Resumen

SCHREBLER ARRATIA, R.; AROS MENESES, H.; SCHREBLER GUZMAN, R.  y  CARLESI JARA, C.. Use of polyethylene glycol as organic additive in Copper electrodeposition over stainless steel cathodes. Lat. Am. appl. res. [online]. 2012, vol.42, n.4, pp. 371-376. ISSN 0327-0793.

This study comprise a comparative analysis of the effects of polyethylene glycol (PEG) and other additives used in copper electrodeposition processes over 316 L stainless steel permanent cathodes. Both cyclic voltammetry and potentiostatic pulse techniques showed analogous results with regard to the increase in the use of the real organic additive and the persistence of a more constant roughness level at higher electrodeposition times when PEG baths are used instead of baths containing glue. The mechanism taking place in the presence of PEG corresponds to two-dimensional nucleation together with three-dimensional diffusion grain growth. Furthermore, the contribution of the hydrogen evolution reaction (HER) was observed at t > 15 seconds when additives of PEG + thiourea were used, while the same contribution was observed from the beginning of the reaction in the case of solutions without PEG.

Palabras llave : Polyethylene Glycol; Copper Electrowinning; Organic Additives; Permanent Cathodes.